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Latest phones

Blackview BV8200 Specs:
Specification:
Features:
- 6.5″ display
- Helio G100 chipset
- 8800 mAh battery
- 256 GB storage
- 12 GB RAM
- MIL-STD-810H compliant
- Corning Gorilla Glass 5.
Blackview BV8200
Blackview BV8200 Android smartphone. Announced Dec 2024. Features 6.5″ screen, Helio G100 processor, 8800 mAh battery, 256 GB rom, 12 GB MEMORY, MIL-STD-810H compliant, Corning Gorilla Glass 5.
Configuration
Misc
Price
About 290 EUR
Colors
Black, Green, Orange
Battery
Charging
45W wired
5W reverse wired
Type
8800 mAh
Features
Sensors
Fingerprint (side-mounted), accelerometer, gyro, proximity, compass
Others
USB
USB Type-C, OTG
Radio
FM radio
NFC
Yes
Positioning
GPS, GLONASS, GALILEO, BDS
Bluetooth
5.1, A2DP, LE
WLAN
Wi-Fi 802.11 a/b/g/n/ac, dual-band
Audio
3.5mm jack
No
Loudspeaker
Yes
Front Camera
Video
1080p@30fps
Features
HDR
Single
32 MP, f/2.2, (wide), 1/3.1″
Back Camera
Video
1440p@30fps, 1080p@30fps
Features
LED flash, HDR
Dual
50 MP, f/1.9, (wide), 1/1.57″, PDAF, OIS
13 MP, f/2.2, (ultrawide), 1/3.0″
Ram
UMCP
UMCP
Internal
256GB 12GB RAM
Card slot
microSDXC (dedicated slot)
Platform
GPU
Mali-G57 MC2
CPU
Octa-core (2×2.2 GHz Cortex-A76 & 6×2.0 GHz Cortex-A55)
Chipset
Mediatek Helio G100 (6 nm)
OS
Android 14, Doke OS 4.0
Screen
Secondary screen on the back:
1.3 inches, 360 x 360 pixels, Corning Gorilla Glass 5
Secondary screen on the back:
1.3 inches, 360 x 360 pixels, Corning Gorilla Glass 5
Protection
Corning Gorilla Glass 5
Resolution
1080 x 2400 pixels, 20:9 ratio (~405 ppi density)
Size
6.5 inches, 102.0 cm2 (~72.0% screen-to-body ratio)
Type
IPS LCD, 120Hz, 500 nits
Body
IP68/IP69K dust tight and water resistant (high pressure water jets; immersible up to 1.5m for 30 min)
Drop resistant up to 1.2m
MIL-STD-810H compliant
Dedicated flashlight (top mounted)
IP68/IP69K dust tight and water resistant (high pressure water jets; immersible up to 1.5m for 30 min)
Drop resistant up to 1.2m
MIL-STD-810H compliant
Dedicated flashlight (top mounted)
SIM
Nano-SIM + Nano-SIM
Weight
370 g (13.05 oz)
Dimensions
174.6 x 81.1 x 16.5 mm (6.87 x 3.19 x 0.65 in)
Launch
Status
Available. Released 2024, December 31
Announced
2024, December 31
Connections
Speed
HSPA, LTE
4G bands
1, 2, 3, 4, 5, 7, 8, 12, 13, 17, 18, 19, 20, 25, 26, 28, 30, 34, 38, 39, 40, 41, 66
3G bands
HSDPA 850 / 900 / 1700(AWS) / 1900 / 2100
CDMA 800 / 1900
CDMA 800 / 1900
2G bands
GSM 850 / 900 / 1800 / 1900
Technology
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