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Latest phones
Honor Magic7 Specs:
Specification:
Features:
- 6.78″ display
- Snapdragon 8 Elite chipset
- 5650 mAh battery
- 1024 GB storage
- 16 GB RAM
- Giant rhino glass.
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Honor Magic7
Honor Magic7 Android smartphone. Announced Oct 2024. Features 6.78″ screen, Snapdragon 8 Elite processor, 5650 mAh battery, 1024 GB rom, 16 GB MEMORY, Giant rhino glass.
Configuration
Misc
Price
About 580 EUR
Models
PTP-AN00
Colors
Black, White, Gray, Blue, Gold
Battery
Charging
100W wired
80W wireless
Reverse wireless
5W reverse wired
Type
Si/C 5650 mAh, non-removable
Features
Emergency SOS via satellite (messages and calls)
Emergency SOS via satellite (messages and calls)
Sensors
Fingerprint (under display, ultrasonic), accelerometer, gyro, proximity, compass, color spectrum
Others
USB
USB Type-C 2.0, OTG
Radio
No
Infrared port
Yes
NFC
Yes, HCE, NFC-SIM
Positioning
GPS (L1+L5), GLONASS, BDS (B1I+B1c+B2a), GALILEO (E1+E5a)
Bluetooth
5.4, A2DP, LE, aptX HD
WLAN
Wi-Fi 802.11 a/b/g/n/ac/6/7, dual-band, Wi-Fi Direct
Audio
3.5mm jack
No
Loudspeaker
Yes, with large amplitude stereo speakers
Front Camera
Video
4K@30/60fps, 1080p@30/60fps, gyro-EIS
Single
50 MP, f/2.0, 22mm (wide), 1/2.93″, 0.6µm
Back Camera
Video
4K@24/30/60fps, 1080p@24/30/60/120/240fps, gyro-EIS, OIS, HDR, 10-bit video
Features
Laser AF, LED flash, HDR, panorama
Triple
50 MP, f/1.9, 24mm (wide), 1/1.3″, 1.2µm, dual pixel PDAF
50 MP, f/2.4, 68mm (telephoto), PDAF, OIS, 3x optical zoom
50 MP, f/2.0, 12mm, 122˚ (ultrawide), 1/2.88″, 0.61µm, dual pixel PDAF
Ram
UFS 4.0
UFS 4.0
Internal
256GB 12GB RAM, 512GB 12GB RAM, 512GB 16GB RAM, 1TB 16GB RAM
Card slot
No
Platform
GPU
Adreno 830
CPU
Octa-core (2×4.32 GHz Oryon V2 Phoenix L + 6×3.53 GHz Oryon V2 Phoenix M)
Chipset
Qualcomm SM8750-AB Snapdragon 8 Elite (3 nm)
OS
Android 15, MagicOS 9
Screen
HDR image support
HDR image support
Protection
Giant rhino glass
Resolution
1264 x 2800 pixels (~453 ppi density)
Size
6.78 inches, 111.2 cm2 (~90.5% screen-to-body ratio)
Type
LTPO OLED, 1B colors, 120Hz, Dolby Vision, HDR, 1600 nits (HBM), 5000 nits (peak)
Body
IP68/IP69 dust/water resistant (up to 1.5m for 30 min)
IP68/IP69 dust/water resistant (up to 1.5m for 30 min)
SIM
Dual SIM (Nano-SIM, dual stand-by)
Weight
199 g (7.02 oz)
Dimensions
162.1 x 75.8 x 8 mm (6.38 x 2.98 x 0.31 in)
Launch
Status
Coming soon. Exp. release 2024, November 08
Announced
2024, October 30
Connections
Speed
HSPA, LTE, 5G
5G bands
SA/NSA
4G bands
LTE
3G bands
HSDPA 800 / 850 / 900 / 1700(AWS) / 1900 / 2100
2G bands
GSM 850 / 900 / 1800 / 1900 – SIM 1 & SIM 2
Technology
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