Latest phones
Latest phones
Huawei Pura 70 Pro Specs:
Specification:
Features:
- 6.8″ display
- Kirin 9010 chipset
- 5050 mAh battery
- 1024 GB storage
- 12 GB RAM
- Kunlun Glass 2.
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Huawei Pura 70 Pro
Huawei Pura 70 Pro smartphone. Announced Apr 2024. Features 6.8″ screen, Kirin 9010 processor, 5050 mAh battery, 1024 GB rom, 12 GB MEMORY, Kunlun Glass 2.
Configuration
Misc
Price
About 850 EUR
Models
HBN-AL00
Colors
Black, White, Purple
Battery
Charging
100W wired
80W wireless
20W reverse wireless
18W reverse wired
Type
5050 mAh, non-removable
Features
BDS Satellite Message
BDS Satellite Message
Sensors
Fingerprint (under display, optical), accelerometer, proximity, gyro, compass, color spectrum
Others
USB
USB Type-C 3.1, OTG, DisplayPort 1.2
Radio
No
Infrared port
Yes
NFC
Yes; NFC-SIM, HCE
Positioning
GPS (L1+L5), GLONASS (L1), BDS (B1I+B1c+B2a+B2b), GALILEO (E1+E5a+E5b), QZSS (L1+L5), NavIC
Bluetooth
5.2, A2DP, LE, L2HC
WLAN
Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Audio
3.5mm jack
No
Loudspeaker
Yes, with stereo speakers
Front Camera
Video
Yes, HDR
Features
HDR, panorama
Single
13 MP, f/2.4, (ultrawide), AF
Back Camera
Video
4K, 1080p, HDR, gyro-EIS, OIS
Features
LED flash, panorama, HDR
Triple
50 MP, f/1.4-4.0, 25mm (wide), 1/1.3″, PDAF, Laser AF, OIS
48 MP, f/2.1, 93mm (telephoto), PDAF (5cm – ∞), OIS, 3.5x optical zoom
12.5 MP, f/2.2, 13mm (ultrawide)
Ram
Internal
256GB 12GB RAM, 512GB 12GB RAM, 1TB 12GB RAM
Card slot
No
Platform
CPU
Octa-core (1×2.3 GHz Taishan Big & 3×2.18 GHz Taishan Mid & 4×1.55 GHz Cortex-A510)
Chipset
Kirin 9010 (7 nm)
OS
HarmonyOS 4.2
Screen
Protection
Kunlun Glass 2
Resolution
1260 x 2844 pixels (~460 ppi density)
Size
6.8 inches, 109.0 cm2 (~89.3% screen-to-body ratio)
Type
LTPO OLED, 1B colors, HDR, 120Hz, 2500 nits (peak)
Body
IP68 dust/water resistant (up to 2m for 30 min)
IP68 dust/water resistant (up to 2m for 30 min)
SIM
Dual SIM (Nano-SIM, dual stand-by)
Build
Glass front, aluminum frame, glass back
Weight
220 g (7.76 oz)
Dimensions
162.6 x 75.1 x 8.4 mm (6.40 x 2.96 x 0.33 in)
Launch
Status
Coming soon. Exp. release 2024, April 29
Announced
2024, April 18
Connections
Speed
HSPA, LTE, 5G
5G bands
SA/NSA
4G bands
LTE
CDMA2000 1x
CDMA2000 1x
3G bands
HSDPA 850 / 900 / 1700(AWS) / 1900 / 2100
CDMA 800
CDMA 800
2G bands
GSM 850 / 900 / 1800 / 1900 – SIM 1 & SIM 2
Technology
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