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Latest phones
ZTE nubia Red Magic 10 Pro+ Specs:
Specification:
Features:
- 6.85″ display
- Snapdragon 8 Elite chipset
- 7050 mAh battery
- 1024 GB storage
- 24 GB RAM
- Unspecified.
ZTE nubia Red Magic 10 Pro+
ZTE nubia Red Magic 10 Pro+ Android smartphone. Announced Nov 2024. Features 6.85″ screen, Snapdragon 8 Elite processor, 7050 mAh battery, 1024 GB rom, 24 GB MEMORY, Unspecified.
Configuration
Misc
Price
About 780 EUR
Colors
Dark Knight, White Knight, Transparent Silver Deuterium, Transparent Dark Knight
Battery
Charging
120W wired, 50% in 11 min, 100% in 30 min (advertised)
Type
Si/C 7050 mAh, non-removable
Features
Sensors
Fingerprint (under display, optical), accelerometer, gyro, proximity, compass
Others
USB
USB Type-C 3.2 Gen 2, OTG, accessory connector, DisplayPort
Radio
No
Infrared port
Yes
NFC
Yes (market/region dependent)
Positioning
GPS (L1+L5), GLONASS, BDS, GALILEO
Bluetooth
5.4, A2DP, LE
WLAN
Wi-Fi 802.11 a/b/g/n/ac/6e/7, tri-band, Wi-Fi Direct
Audio
32-bit/384kHz Hi-Res audio
Snapdragon Sound
32-bit/384kHz Hi-Res audio
Snapdragon Sound
3.5mm jack
Yes
Loudspeaker
Yes, with stereo speakers
Front Camera
Video
1080p@30/60fps
Features
HDR
Single
16 MP, f/2.0, (wide), 1/3.06″, 1.0µm, under display
Back Camera
Video
8K@30fps, 4K@30/60fps, 1080p@30/60/120/240fps
Features
LED flash, HDR, panorama
Triple
50 MP, f/1.9, (wide), 1/1.5″, 1.0µm, PDAF, OIS
50 MP, f/2.2, (ultrawide), 1/2.88″, 0.61µm
2 MP, f/2.4, (macro)
Ram
UFS 4.0 Pro
UFS 4.0 Pro
Internal
512GB 16GB RAM, 1TB 24GB RAM
Card slot
No
Platform
GPU
Adreno 830
CPU
Octa-core (2×4.32 GHz Oryon V2 Phoenix L + 6×3.53 GHz Oryon V2 Phoenix M)
Chipset
Qualcomm SM8750-AB Snapdragon 8 Elite (3 nm)
OS
Android 15, Redmagic OS 10
Screen
Protection
Unspecified
Resolution
1216 x 2688 pixels (~431 ppi density)
Size
6.85 inches, 113.7 cm2 (~91.4% screen-to-body ratio)
Type
AMOLED, 1B colors, 144Hz, 2000 nits (peak)
Body
Pressure sensitive zones (520Hz touch-sensing)
Built-in cooling fan
Aviation aluminum middle frame
Pressure sensitive zones (520Hz touch-sensing)
Built-in cooling fan
Aviation aluminum middle frame
SIM
Dual SIM (Nano-SIM, dual stand-by)
Build
Glass front, aluminum frame, glass back
Weight
229 g (8.08 oz)
Dimensions
163.4 x 76.1 x 8.9 mm (6.43 x 3.00 x 0.35 in)
Launch
Status
Available. Released 2024, November 18
Announced
2024, November 13
Connections
Speed
HSPA, LTE, 5G
5G bands
SA/NSA
4G bands
LTE
CDMA2000 1xEV-DO
CDMA2000 1xEV-DO
3G bands
HSDPA 850 / 900 / 1700(AWS) / 1900 / 2100
CDMA 800 / 1900
CDMA 800 / 1900
2G bands
GSM 850 / 900 / 1800 / 1900 – SIM 1 & SIM 2
Technology
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